Essential details
Shipping:Express delivery
Product Introduction
Number of floors: 12-18 floors
Substrate: FR4
Dielectric constant: 4.3
Outer/inner copper thickness: inner 6oz/outer 8oz
Plate thickness: 4.3mm
Surface treatment: immersion gold plating
Minimum line width/spacing: 1mm/1mm
Application field: power supply
Features: thick copper plate, winding PCB, ultra-thick plate, high reliability
Substrate: FR4
Dielectric constant: 4.3
Outer/inner copper thickness: inner 6oz/outer 8oz
Plate thickness: 4.3mm
Surface treatment: immersion gold plating
Minimum line width/spacing: 1mm/1mm
Application field: power supply
Features: thick copper plate, winding PCB, ultra-thick plate, high reliability